Difference between revisions of "Published Papers (DIW)"

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== Count ==
 
== Count ==
  
691 total documents as of 14 January, 2026.
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701 total documents as of 29 January, 2026.
  
 
== '''[[Reservoir_Heads|Unheated or Chilled Reservoir Printing]]''' ==
 
== '''[[Reservoir_Heads|Unheated or Chilled Reservoir Printing]]''' ==
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== DIW/SEP/SSE, 2026 ==
 
== DIW/SEP/SSE, 2026 ==
  
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* [https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.70442 Optimization in 3D Printable Silicone DIW Ink Formulations: Gelling Behavior Control and the Use of Carbon Nanotubes] by a team from [https://case.edu/ Case Western Reserve University], [https://www.ndsu.edu/ North Dakota State University], [https://www.utk.edu/ University of Tennessee, Knoxville], and [https://www.ornl.gov/facility/cnms Center for Nanophase Materials and Sciences, Oak Ridge National Laboratory]
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* [https://www.sciencedirect.com/science/article/abs/pii/S0272884226002567 Rheology and Printability of a Highly Loaded Silicon Nitride Colloidal Ink for Hierarchically Porous Ceramic Fabrication via Direct Ink Writing] by a team from [https://www.iitbhu.ac.in/ Indian Institute of Technology (B.H.U), Varanasi]
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* [https://www.researchsquare.com/article/rs-8272336/v1 Spatially-resolved Humidity Sensing by Capacitive-CMOS Arrays] by a team from [https://uni-freiburg.de/en/ University of Freiburg, Germany], [https://www.tudelft.nl/en/ Delft University of Technology (TU Delft)], and [https://www.nxp.com/ NXP Semiconductors, Netherlands]
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* [https://www.researchgate.net/profile/Carolina-Herrera-Lavados/publication/399742613_Stability_printability_and_postprocessing_of_low_oil_emulsion_gels_for_3D_printing_Effect_of_guar_gum_locust_bean_gum_and_oil_concentration/links/6969130eee048155cffc1133/Stability-printability-and-postprocessing-of-low-oil-emulsion-gels-for-3D-printing-Effect-of-guar-gum-locust-bean-gum-and-oil-concentration.pdf Stability, Printability, and Postprocessing of Low Oil Emulsion Gels for 3D Printing: Effect of Guar Gum, Locust Bean Gum, and Oil Concentration]  by a team from [https://www.ubiobio.cl/ Universidad del Bío-Bío Chile]
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* [https://www.nature.com/articles/s44334-025-00060-x#author-information Effect of Carbon Fiber Reinforcement and Sintering Temperature on Mechanical Properties, Thermal Shock Resistance, and Oxidation Behavior of Zirconium Diboride Formed via Material Extrusion Additive Manufacturing] by a team from [https://www.afrl.af.mil/RX/ Air Force Research Laboratory, Materials and Manufacturing Directorate], [https://www.avinc.com/ AV Inc., Dayton, OH], [https://www.nationalacademies.org/programs/PGA-FP-18-P-27 National Academy of Sciences Air Force Science & Technology Fellowship Program, Washington, DC], and [https://www.soche.org/ SOCHE, Dayton, OH]
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* [https://www.sciencedirect.com/science/article/pii/S2772502226000302 Stability, Printability, and Postprocessing of Low Oil Emulsion Gels for 3D Printing: Effect of Guar Gum, Locust Bean Gum, and Oil Concentration] by a team from [https://www.ubiobio.cl/ Universidad del Bío-Bío Chile]
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* [https://www.sciencedirect.com/science/article/pii/S2666833526000080#sec0021 “it Takes the Identity Out of the Food”: Soldiers’ Perceptions of 3D-printed Food] by a team from [https://sc.devcom.army.mil/ U.S. Army DEVCOM Soldier Center, Natick, MA]
 
* [https://www.sciencedirect.com/science/article/abs/pii/S2214860426000011 Self-supported Vapor-Induced Phase-Separation Direct Ink Writing of 3D Cellular Lattices With Subroutine-enabled Tool Path Generation] by a team from [https://www.ufl.edu/ University of Florida, Gainesville], [https://www.clemson.edu/ Clemson University], and [https://www.udel.edu/ University of Delaware]
 
* [https://www.sciencedirect.com/science/article/abs/pii/S2214860426000011 Self-supported Vapor-Induced Phase-Separation Direct Ink Writing of 3D Cellular Lattices With Subroutine-enabled Tool Path Generation] by a team from [https://www.ufl.edu/ University of Florida, Gainesville], [https://www.clemson.edu/ Clemson University], and [https://www.udel.edu/ University of Delaware]
 
 
* [https://arxiv.org/pdf/2601.00320 Multispectral UV Imaging on Capacitive CMOS Arrays Enabled by Solution-Processed Metal-Oxide Nanoparticles] by a team from [https://www.tudelft.nl/en/ Delft University of Technology (TU Delft), The Netherlands] and [https://www.nxp.com/ NXP Semiconductors]
 
* [https://arxiv.org/pdf/2601.00320 Multispectral UV Imaging on Capacitive CMOS Arrays Enabled by Solution-Processed Metal-Oxide Nanoparticles] by a team from [https://www.tudelft.nl/en/ Delft University of Technology (TU Delft), The Netherlands] and [https://www.nxp.com/ NXP Semiconductors]
 
* [https://books.google.com/books?hl=en&lr=lang_en&id=fnylEQAAQBAJ&oi=fnd&pg=PA288&dq=hyrel&ots=o2PGSbnXyA&sig=uAoNI-BQowoT35i22HdkDITffUQ#v=onepage&q=hyrel&f=false Additive Manufacturing of Wood Nanocomposites Using Natural Fibers] by a team from the [https://www.uh.edu University of Houston] and [https://www.rice.edu/ Rice University]
 
* [https://books.google.com/books?hl=en&lr=lang_en&id=fnylEQAAQBAJ&oi=fnd&pg=PA288&dq=hyrel&ots=o2PGSbnXyA&sig=uAoNI-BQowoT35i22HdkDITffUQ#v=onepage&q=hyrel&f=false Additive Manufacturing of Wood Nanocomposites Using Natural Fibers] by a team from the [https://www.uh.edu University of Houston] and [https://www.rice.edu/ Rice University]

Latest revision as of 16:16, 29 January 2026

The Published Papers page ran too long, so the pages for Unheated or Chilled Reservoir Printing are listed here, by year of publication.

The information about Unheated or Chilled Reservoir Printing, also known as Robocasting or DIW (Direct Ink Writing), SEP (Semisolid Extrusion Printing), SSE (Semisolid Extrusion). 3DCP (3D Concrete Printing), or DCC (Digital Concrete Construction), ran too long, and has been split off here.

To see the list of non-DIW papers, please visit the Published Papers page.

Count

701 total documents as of 29 January, 2026.

Unheated or Chilled Reservoir Printing

Also known as Robocasting or DIW (Direct Ink Writing), VIPS-DIW (Vapor-Induced Phase-Separation Direct Ink Writing), SEP (Semisolid Extrusion Printing), SSE (Semisolid Extrusion). 3DCP (3D Concrete Printing), or DCC (Digital Concrete Construction).

DIW/SEP/SSE, 2026

DIW/SEP/SSE, 2025

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DIW/SEP/SSE, 2024

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DIW/SEP/SSE, 2023

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DIW/SEP/SSE, 2022

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DIW/SEP/SSE, 2021

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DIW/SEP/SSE, 2020

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DIW/SEP/SSE, 2019

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DIW/SEP/SSE, 2018

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DIW/SEP/SSE, 2017

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DIW/SEP/SSE, 2016

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DIW/SEP/SSE, 2015

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DIW/SEP/SSE, 2014

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